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| Advanced Technical Information GWM 70-01P2 VDSS = 100 V ID25 = 70 A RDSon typ. = 11 m Three phase full bridge with Trench MOSFETs in DCB isolated high current package L+ G3 G1 S3 S1 L1 L2 L3 G4 G2 S4 S2 G6 S6 LS5 G5 Pins Gate Pow s er Pin MOSFETs Symbol VDSS VGS ID25 ID90 IF25 IF90 TC = 25C TC = 90C TC = 25C (diode) TC = 90C (diode) Conditions TVJ = 25C to 150C Maximum Ratings 100 20 70 50 130 85 V V A A A A Applications AC drives * in automobiles - electric power steering - starter generator * in industrial vehicles - propulsion drives - fork lift drives * in battery supplied equipment Features * MOSFETs in trench technology: - low RDSon - optimized intrinsic reverse diode * package: - high level of integration - high current capability - auxiliary terminals for MOSFET control - terminals for soldering or welding connections - isolated DCB ceramic base plate with optimized heat transfer Symbol Conditions Characteristic Values (TVJ = 25C, unless otherwise specified) min. typ. max. TVJ = 25C TVJ = 125C 2 0.1 0.2 110 18 44 35 85 150 70 0.8 80 1.7 1.25 11 24 14 m m 4 1 V A mA A nC nC nC ns ns ns ns V ns 0.85 K/W K/W RDSon VGSth IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf VF t rr RthJC RthJH on chip level at VGS = 10 V; ID = 35 A VDS = 20 V; ID = 1 mA VDS = VDSS; VGS = 0 V; TVJ = 25C TVJ = 125C VGS = 20 V; VDS = 0 V VGS= 10 V; VDS = 80 V; ID = 25 A VGS= 10 V; VDS = 30 V; ID = 25 A; RG = 10 (diode) IF = 35 A; VGS= 0 V (diode) IF = 75 A; -di/dt = 100 A/s; VDS = 30 V with heat transfer paste IXYS reserves the right to change limits, test conditions and dimensions. (c) 2006 IXYS All rights reserved 1-2 0604 Advanced Technical Information GWM 70-01P2 Component Symbol IRMS TVJ Tstg VISOL FC Symbol IISOL 1 mA; 50/60 Hz; t = 1 min Mounting force with clip Conditions Conditions per pin in main current paths (L+, L-, L1, L2, L3) may be additionally limited by external connections Equivalent Circuits for Simulation Maximum Ratings 300 -40...+175 -55...+125 1000 50 - 250 A C C V~ N junction - case (typ.) Cth1 = 0.039 J/K; Rth1 = 0.28 K/W Cth2 = 0.069 J/K; Rth2 = 0.57 K/W Thermal Response Characteristic Values (TVJ = 25C, unless otherwise specified) min. typ. max. 0.6 m pF g Rpin to chip CP Weight coupling capacity between shorted pins and mounting tab in the case typ. 160 25 Dimensions in mm (1 mm = 0.0394") S6 G6 S5 G5 S4 G4 S3 G3 S2 G2 S1 G1 L3 L2 L1 L- L+ (c) 2006 IXYS All rights reserved 2-2 0604 |
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